Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Conductive diamond: synthesis, properties, and electrochemical applications - Chemical Society Reviews (RSC Publishing) DOI:10.1039/C7CS00757D

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

A review of helical nanostructures: Growth theories, synthesis strategies and properties

CO2 electrolysis: Advances and challenges in electrocatalyst engineering and reactor design - ScienceDirect

BJNANO - Characterization and properties of micro- and nanowires of controlled size, composition, and geometry fabricated by electrodeposition and ion-track technology

Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

Huiqin LING, Shanghai Jiao Tong University, Shanghai, SJTU, State Key Laboratory of Metal Matrix Composites

Engineering 3D Architecture Electrodes for High-Rate Aqueous Zn–Mn Microbatteries

A review of helical nanostructures: Growth theories, synthesis strategies and properties

Impact of Nanosize on Supercapacitance: Study of 1D Nanorods and 2D Thin-Films of Nickel Oxide

Electrochemical Patterning of Cu Current Collectors: An Enabler for Pure Silicon Anodes in High‐Energy Lithium‐Ion Batteries - Schlaier - 2022 - Advanced Materials Interfaces - Wiley Online Library